Kunshan Shimai New Materials Technology Co., Ltd. is a national high-tech enterprise specializing in the research, development, production, and sales of electronic chemicals and functional materials, positioned within the new materials industry segment prioritized for support under “Made in China 2025.” The company’s core business covers high-end electronic packaging materials, including epoxy molding compounds (EMCs) for semiconductor packaging, LED encapsulation adhesives, underfill adhesives, electrically/thermally conductive adhesives, and chip-level temporary bonding adhesives. Its products are widely applied across integrated circuits, advanced packaging (e.g., Fan-Out, 2.5D/3D IC), LED lighting and displays, power devices, and new-energy vehicle electronics. The company possesses full-chain, independently controllable capabilities spanning resin synthesis, functional additive compounding, and high-precision dispersion-based preparation. Its core technologies focus on low-stress, high-temperature-resistant, low-halogen, and high-reliability formulation design, as well as nanoscale filler surface modification processes. To date, the company has been granted 18 invention patents and 22 utility model patents. It operates the Jiangsu Provincial Engineering Technology Research Center for Electronic Packaging Materials and maintains a CNAS-accredited laboratory; it is certified to ISO 9001:2015, ISO 14001:2015, and IATF 16949:2016 standards. Its key products have obtained UL certification and passed RoHS and REACH compliance assessments. Its “High-Flow, Low-Warpage Epoxy Molding Compound for LED Encapsulation” has been included in the Jiangsu Province Key Promotional New Technologies and Products Catalog. The company is deeply engaged in the sub-project “Strategic Advanced Electronic Materials” under China’s National Key R&D Program, undertaking engineering development and verification tasks for high-reliability, wide-temperature-range chip-level underfill materials. Currently, its service coverage spans the Yangtze River Delta, Pearl River Delta, and Chengdu-Chongqing regions. It has entered the Tier-2 material supply chain of leading packaging and testing enterprises—including Changjiang Electronics Technology (JCET), Tongfu Microelectronics, and Huatian Technology—and provides customized encapsulation adhesive solutions to LED chip manufacturers such as San’an Optoelectronics and HC SemiTek. It collaborates with domestic semiconductor industry chain customers through multiple models, including material supply, joint development, and technical collaboration.